High-Precision Metrology System Allows 3D Heterogeneous Integration

EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has unveiled the EVG 40 NT2 automated metrology system, which provides overlay and critical dimension (CD) measurements for wafer-to-wafer (W2W), die-to-wafer (D2W) and …