Wafer Handlermechatronic Packing Tool

Wafer Handlermechatronic Packing Tool

개요

효율적인 웨이퍼 물류 시스템

  메카트로닉의 mPT(mechatronic Packing Tool)시리즈는 최신형 기술의 웨이퍼 패커로서 초박막 또는 휜(Warped) 웨이퍼를 안전하게 취급하는 새로운 표준입니다. 또한 모듈식 설계 개념을 일관되게 구현함으로써 오픈 카세트, FOUP, FOSB를 포함한 다양한 웨이퍼 캐리어와 Shipping Box 간의 완벽한 호환성을 보장합니다. 정교한 센서 기술로 다양한 포장재의 유형을 신뢰성 있게 감지할 수 있습니다.

특징

Packing/Unpacking

  • mPT 150/200 는 비 접촉식 엔드이펙터를 사용하여 150/200 mm (6”/8″) 웨이퍼를 포장/포장해제 할 수 있도록 설계되었습니다.
  • mPT 200/300f 는 진공 엔드이펙터를 사용하여 200/300 mm (8″/12″) 프레임의 웨이퍼를 포장/포장해제 할 수 있도록 설계되었습니다.
  • mPT 200/300 는 베르누이(Bernoulli)엔드이펙터를 사용하여 200/300 mm (8″/12”) 웨이퍼를 포장/포장해제 할 수 있도록 설계되었습니다.

 

  • mPT 200/300 neo 는 베르누이(Bernoulli)엔드이펙터를 사용하여 200/300 mm (8″/12”) 웨이퍼를 포장/포장해제 할 수 있도록 설계되었습니다.

 

스펙

mPT 150/200:

  • Wafer sizes: 150 mm (6”) and 200 mm (8”)
  • handling of standard, thin, warped, eWLB, wafer with support ring and MEMS wafers
  • highest level of reliability and availability
  • optimized footprint
  • 5 stations for shipping boxes and packing material
  • automatic End Effector changing station
  • two cassette stations
  • mapping sensor
  • pre-aligner for 6″ and 8″
  • SECS/GEM interface
  • CE certificated
  • SEMI standard compliant

mPT 200/300f:

  • Wafer size: 200mm (8″) and 300 mm (12”) on frame
  • handling of wafers on frame
  • highest level of reliability and availability
  • two 6 axle robots for optimized footprint
  • up to 8 stations for shipping boxes and packing material
  • automatic End Effector changing station
  • two stations for frame cassettes
  • SECS/GEM interface
  • CE certificated
  • SEMI standard compliant

mPT 200/300:

  • Wafer size: 200mm (8″) and 300 mm (12”)
  • handling of standard, thin, warped, eWLB, wafer with support ring and MEMS wafers
  • highest level of reliability and availability
  • two 6 axle robots for optimized footprint
  • up to 8 stations for shipping boxes and packing material
  • automatic End Effector changing station
  • two load-ports
  • mapping sensor
  • pre-aligner for 8″ and 12″
  • SECS/GEM interface
  • CE certificated
  • SEMI standard compliant

mPT 200/300 neo:

  • Wafer size: 200mm (8″) and 300 mm (12”)
  • handling of standard, thin, warped, eWLB, wafer with support ring and MEMS wafers
  • optimized foodprint
  • high troughput
  • highest level of reliability and availability
  • dual arm 3 axis robot
  • station for shipping boxes
  • two stations for packing material
  • one station for recycling material
  • GUI/Operator interface with touchscreen
  • two load-ports
  • pre-aligner for 8″ and 12″
  • CE certificated
  • SEMI standard compliant

Configuration Options:

  • third station for packing material
  • Sorting function w. FOSBs
  • OCR / QR / DMC reader for wafer ID
  • Bar Code Reader for shipping box ID
  • RFID antennas for cassette / FOUP ID
  • Various End Effectors with automatic End Effector change station
  • SECS/GEM interface
  • FFU (filter fan unit) for higher cleanroom class
  • Ionizer with temperature and humidity monitoring
  • Keyboard, manual Lot ID Reader
  • additional load / unload position for external metrology
 

카탈로그

  • mPT 150/200

  • mPT 200/300

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